UEN30-UCaEN30 Encapsulated Panel
Chipboard core encapsulated raised floor panel
ТЕХНИЧЕСКИЕ ХАРАКТЕРИСТИКИ
| Boyut | 600x600mm |
|---|---|
| Yuk kapasitesi | Dağılık: 12kN, Nokta: 3kN |
| Kalinlik | 30mm |
Chipboard core encapsulated raised floor panel
Chipboard core encapsulated raised floor panel
| Boyut | 600x600mm |
|---|---|
| Yuk kapasitesi | Dağılık: 12kN, Nokta: 3kN |
| Kalinlik | 30mm |